二手，美国 UNITEK MICROPULL IV 拉力试验机

二手，美国 UNITEK MICROPULL IV 拉力试验机

UNITEK MP4 Micropull IV Semiautomatic Wire Bond Pull Tester

功能OK

UNITEK MP4 Micropull IV Semiautomatic Wire Bond Pull Tester
According to industry statistics, insufficient bond strength is a major cause of device failure. Bond pull tests are routinely used to evaluate and/or control the mechanical strength of wire bonds in microcircuit devices.

The Miyachi Unitek Micropull IV (MP4) is a semi-automatic machine designed to perform wire bond pull tests in the 0.5 to 1000 gram force range. It can automatically detect wire bond failures occurring during the test, as well as excessive wire bond loop height.
To perform a wire bond test, the operator need only position the hook directly under the midpoint of each wire bond.

The hook is then raised until the bond is stressed to a predetermined value (non-destructive pull test-NDPT), or the wire breaks (destructive pull test-DPT). The MP4 displays the results and outputs them via an RS-232 type serial interface. Using three interchangeable beams, the MP4 may perform these tests at rates of up to one test per second.